Document Type

Thesis

Date of Award

Fall 8-12-2013

Keywords

Adhesive Dispensing, Epoxies, Gage R&R, Jetting, Printed Circuit Board, Process Capability Index, Semiconductors, Statistical Process Control, Surface Mount Technology, Underfill Materials

Degree Name

Master of Science in Industrial Engineering (MSIE)

Department

Systems Science and Industrial Engineering

First Advisor

Dr. Daryl Santos

Second Advisor

Dr. Nagen Nagarur

Third Advisor

Tom Karlinski

Abstract

With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a more refined non-contact dispensing terminology named “Streaming” is widely used to stream out material at low volumes for various applications. The key solution is to frame a dispensing method that lends itself most closely to the requirements of a specific production process.

This study represents a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot diameter repeatability, dot quality, and process capability through experimental design runs.

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